Product Description
Solder Balls yog tsim los ntawm siab -purity tin-raws li alloys los ntawm precision molding txheej txheem los tsim micron - nplai, siab - precision spheres. Lawv tau dav siv hauv semiconductor pob technologies, Pob Grid Array (BGA), Chip Scale Ntim (CSP), FlipChip, thiab Wafer Level Ntim (WLCSP). Cov khoom lag luam muaj xws li cov khoom siv lead ua -dawb alloys, tooj liab-core Solder Balls, thiab qis- Solder Balls, tsim kom tau raws li cov txheej txheem sib txawv, cov lus qhia tshwj xeeb, thiab cov qauv kev ntseeg tau, yog li txhim kho cov ntim khoom tawm los thiab ntev - lub sijhawm ua haujlwm ruaj khov.
Nta
- Siab sphericity
- Uniform loj
- Vuam stability
- Txheej txheem - phooj ywg
- Ntau hom kev xaiv
- Kev ntseeg siab
Specifications thiab Qauv
Rau tej txoj kab uas hla, alloy hom, tooj liab core / qis specification, qauv qauv, los yog quotes, thov hu rau peb cov neeg siv khoom. Peb yuav muab cov kev daws teeb meem rau Solder Balls uas haum rau koj cov txheej txheem ntim khoom, lub suab nyob deb, thiab kev ntseeg tau.
| Classification Dimension | Yam khoom | Core Features thiab Application Scenarios |
| Alloy System | Lead-dawb tin-raws li cov pob | Universal hom, sib xws nrog feem ntau BGA / CSP pob. |
| SAC series muaj cov khoom siv solder. | Qhov sib npaug ntawm lub zog thiab kub tsis kam, ua rau nws qhov kev xaiv zoo tshaj plaws rau kev ntim khoom loj. | |
| Hom qauv | Solid Solder Balls | High versatility nrog qhov sib npaug ntawm tus nqi thiab kev ua haujlwm. |
| Copper Core Solder Balls | Qhov sib txawv muaj qhov ua tau zoo ruaj khov nrog cov cua kub zoo tshaj plaws thiab kev txav chaw zoo dua. | |
| Muaj nuj nqi tshwj xeeb | Tsawg-Alpha Solder Balls | Cov khoom tsis tshua muaj, haum rau cov chips rhiab xws li cov khoom siv cia. |
Khoom Zoo
- High precision stability: Zoo heev tswj qhov ntev thiab sphericity, txhim kho pob cog yield.
- Txhim khu kev qha vuam: zoo wettability thiab sau cov khoom, txo cov vuam tsis xws luag.
- High -kev sib raug zoo ntawm qhov sib xws: Txhawb cov suab zoo thiab cov kev xav tau ntawm kev ntim khoom.
- Txheej Txheem Compatibility: Tau tshaj nrog cov cuab yeej siv hluav taws xob los txhim kho kev tsim khoom.
- Ntau hom: Haum rau cov kev xav tau siab tshaj xws li cov qauv, siab kub dissipation, thiab qis.
- Kev tswj tau zoo: Qib oxidation qis ua rau lub sijhawm ntev - khaws cia thiab kev ua haujlwm ruaj khov.
Daim ntawv thov
- BGA / CSP / FBGA nti pob khoom
- Flip Chip Pob
- Wafer{0}}Level Chip Scale Package (WLCSP)
- Nco, Processor, Siab -kawg SoC Ntim
- Mobile Terminals, Automotive Electronics, Consumer Electronics
- High-frequency High-speed, Siab-kev ntseeg tau Semiconductor Devices
Cim npe nrov: Tuam Tshoj Solder Balls manufacturers, lwm tus neeg, Hoobkas
