Name: Tuam Tshoj Ceramic Small Outline Pob (CSOP) Chaw tsim khoom Hoobkas - OEM Service - Tessvida
Brand: Tessvida
SKU: 310713163

Ceramic Small Outline Pob (CSOP)

Miniaturized hneev taw nrog kev tiv thaiv ceramic zoo rau qhov chaw - txwv PCB tsim.

Cov Ceramic Small Outline Package (CSOP) yog ib qho kev daws teeb meem me me uas muaj lub tis - hom qauv tsim (ua tau zoo li tis), uas ua haujlwm zoo li lub caij nplooj ntoos hlav los tiv thaiv lub siab ntawm pob thiab lub rooj tsav xwm Circuit Court, zoo txo qhov kev pheej hmoo ntawm kev xoob lossis kev puas tsuaj uas yuav tshwm sim los ntawm ib puag ncig kev hloov pauv. Cov pob no yog compact, qhov chaw -txuag, thiab boasts zoo heev sealing kev ua tau zoo, ua rau nws haum rau siv nyob rau hauv damp puag ncig. Cov khoom lag luam los ntawm tus qauv nrog 1.27mm lead suab, tab sis peb tuaj yeem muab cov kev daws teeb meem nrog cov pitches nqaim ntawm 1.00mm, 0.80mm, lossis 0.65mm rau qhov xav tau ntau qhov chaw ntim khoom.

Cov ntaub ntawv muaj: alumina, aluminium nitride, siab -kub co- hluav taws xob ceramic, tungsten-manganese, lossis molybdenum- manganese metallization txheej.
Daim Ntawv Thov: Semiconductor & Electronics, Cov Khoom Siv Kho Mob, Zog & Lub Zog, thiab Khoom Siv & Machinery

Xa kev nug

Product Description

Txhawm rau txo cov kev pheej hmoo tawg nyob rau hauv kev vibration lossis thermal cycling, tus gull -tis lead tsim ntawm CSOP zoo buffers thermal stress thiab xa tshwj xeeb shock resistance. Ua ke nrog cov cua kub zoo tshaj, rwb thaiv tsev, thiab EMI shielding, nws ua kom lub purity thiab stability ntawm cov teeb liab kis tau tus mob.

Nta

Zoo heev thermal stress buffering muaj peev xwm
Muaj zog ntev -lub sij hawm ib puag ncig stability
Zoo heev -frequency suab suppression
Txhawb siab - kev ntsuas kev ntseeg tau thiab rov ua haujlwm dua
Zoo heev vibration thiab poob siab kuj
Lub neej ua haujlwm ntev

Kev ua haujlwm siab hluav taws xob rwb thaiv tsev
Tsawg resistivity
Zoo corrosion kuj
High noo noo tsis kam
High electromagnetic cuam tshuam (EMI) tsis kam
Tsawg coefficient ntawm thermal expansion (CTE)

Main Model Rooj (mm)

CSOP ntim muaj Alumina, AlN, thiab HTCC substrates nrog cov pov thawj tuab -film metallization. Ntxiv rau tus qauv 1.27mm suab, peb muab ntau yam zoo - suab xaiv xws li 1.00mm, 0.80mm, thiab 0.65mm.

Yam khoom qauv	Ceramic Lub Cev Loj	Lead Pitch	Sealing Area	Tuag Attach Area	Tag nrho Thickness
SIB 04-02	5.40×3.60×1.50	1.27	3.50×3.60	1.50×1.60	1.7

Ceramic Expertise

Tessvida yog tus kws tshaj lij Total Kit Solutions (TKS), ua haujlwm tseem ceeb hauv kev lag luam: semiconductor & electronics, khoom siv kho mob, FPD/LED, machinery, petrochemicals, auto & Transportation, zog & hwj chim, thiab zaub mov & kev ua liaj ua teb. Nrog rau cov saw hlau loj thiab cov txheej txheem siab heev (isostatic nias, gel casting, nias qhuav), peb muab qhov kawg - mus rau - kawg peev xwm los ntawm kev npaj cov khoom, molding, sintering rau precision machining thiab post- ua.

Rov qab los ntawm kev txawj ntse tob hauv siab - ceramics purity thiab muaj zog sib koom ua ke, peb cov kev pabcuam hloov tau yooj yim raws li cov neeg siv khoom xav tau los ntawm kev xaiv cov khoom mus rau cov khoom tiav.